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1 of 11 optimum technology matching? applied gaas hbt ingap hbt gaas mesfet sige bicmos si bicmos sige hbt gaas phemt si cmos si bjt gan hemt functional block diagram rf micro devices?, rfmd?, optimum technology matching?, enabling wireless connectivity?, powerstar?, polaris? total radio? and ultimateblue? are trademarks of rfmd, llc. bluetooth is a trade- mark owned by bluetooth sig, inc., u.s.a. and licensed for use by rfmd. all other trade names, trademarks and registered tradem arks are the property of their respective owners. ?2006, rf micro devices, inc. product description 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com. ordering information rf mems ldmos vcc1 nc rf in rf in nc nc pdtect nc rf out rf out vcc2 nc nc vcc b vreg1 vreg2 16 15 5 6 8 9 10 11 12 4 3 2 1 7 14 13 bias circuit input match interstage match power detector RF5102 3v to 5v linear power amplifier for 2.4ghz wifi the RF5102 is a linear, medium-power, high-efficiency, two-stage amplifier ic designed specifically for battery-powered wifi applications such as pc cards, mini pci, and compact flash applications. the device is manufactured on an advanced ingap gallium arsenide heterojunction bi polar transistor (hbt) process, and has been designed for use as the final rf am plifier in 2.5ghz ofdm and other spread- spectrum transmitters. the device is provided in a 3mmx3mmx0.9mm, 16-pin, qfn with a backside ground. the RF5102 is designed to maintain linearity over a wide range of supply voltage and power output. features ? single power supply 3.0v to 5v ? +21dbm, <4.0%evm, 185ma at v cc =3.3v ? +23dbm, <4% evm, 250ma at v cc =5.0v ? 28db typical small signal gain ? 50 ? input and interstage match- ing ? 2400mhz to 2500mhz frequency range applications ? ieee802.11b/g/n wifi applica- tions ? 2.5ghz ism band applications ? commercial and consumer sys- tems ? portable battery-powered equip- ment ? spread-spectrum and mmds systems RF5102 standard 25 piece bag RF5102sr standard 100 piece reel RF5102tr7 standard 2500 piece reel RF5102pck-41x fully assembled evaluation board kit (3.3v tune) RF5102wl50pck-41x fully assembled evaluation board kit (5.0v tune) ds110617 ? package style: qfn, 16-pin, 3mmx3mmx0.9mm
2 of 11 RF5102 ds110617 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com. absolute maximum ratings parameter rating unit supply voltage 5 v power control voltage (v reg )3.3v dc supply current 500 ma input rf power +5 dbm operating ambient temperature -40 to +85 c storage temperature -40 to +150 c moisture sensitivity msl2 parameter specification unit condition min. typ. max. compliance and nominal conditions ieee802.11g, ieee802.11b, fcc cfg 15.247, .205, .209, en and jdec v cc =3.3v, v reg =2.85v pulsed at 1% to 99% duty cycle ,temp=+25c, freq=2.4ghz to 2.5ghz, ofdm 54mbps signal, unless noted otherwise. frequency range 2400 2500 mhz linear output power 21.0 dbm v cc =3.3v. meets 802.11g spectral mask 23.0 dbm v cc =5.0v. meets 802.11g spectral mask evm 3.3 4.0 % p out =+21dbm, 54m ofdm, v cc =3.3v dc 3.3 4.0 % p out =+23dbm, 54m ofdm, v cc =5.0v dc gain 26 28 db both p out =+21dbm and +23dbm. v cc =3.3v and 5.0v. input impedance 50 ? internally matched input and interstage output vswr 10:1 no spurs above -43dbm power detector (p_detect) p out =21dbm 0.13 1.10 v v cc =3.3v p out =23dbm 0.13 2.2 v v cc =5.0v power supply operating voltage 3.0 3.3 5.0 v dc 5v operation requires output match revision v reg (bias) voltage (v reg1 , v reg2 ) 2.75 2.85 2.95 v dc current consumption 185 ma rf p out =+21dbm, v cc =3.3v, 54mbps ofdm 250 rf p out =+23dbm, v cc =5.0v, 54mbps ofdm quiescent current 95 ma rf=off leakage current 10 ua v cc =on; rf in=off; v reg off v reg (bias) current (total) 3 ma v cc =3.3v 3mav cc =5.0v caution! esd sensitive device. exceeding any one or a combination of the absolute maximum rating conditions may cause permanent damage to the device. extended application of absolute maximum rating conditions to the device may reduce device reliability. specified typical perfor- mance or functional operation of the devi ce under absolute maximum rating condi- tions is not implied. rohs status based on eudirective2002/95/ec (at time of this document revision). the information in this publication is believed to be accurate and reliable. however, no responsibility is assumed by rf micro devices, inc. ("rfmd") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. no license is granted by implication or otherwise under any patent or patent rights of rfmd. rfmd reserves the right to change component circuitry, recommended appli- cation circuitry and specifications at any time without prior notice.
3 of 11 RF5102 ds110617 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com. pin function description interface schematic 1nc not connected. may be connected to ground (gnd). 2rf in rf input. see evaluation board schematic for details. 3rf in rf input. see evaluation board schematic for details. see pin 2. 4nc not connected. may be connected to ground (gnd). 5nc do not connect. note: vcc voltage may be applied to this pin without damage to, or affect- ing the performance of, the RF5102. 6vreg1 bias current control voltage for the first stage. 7vreg2 bias current control voltage for the second stage. the vreg2 pin may be connected to vreg1 through an external resistor bridge. 8pdetect (or n/c*) provides an output voltage proportional to the output rf level. *in applications where the pdetect function is not desired, this pin may be left unconnected. 9nc no-connect. 10 rf out rf output. 11 rf out same as pin 10. see pin 10. 12 vcc2 power supply for second stage amplifier. connect as shown on evaluation board schematic. 13 nc not connected. may be connected to ground (gnd). 14 vcc1 power supply for first stage amplifier. connect as shown on evaluation board schematic. 15 nc not connected. may be connected to ground (gnd). 16 vcc b supply voltage for the bias reference and control circuits. may be con- nected with vc1 and vc2 (single-supply voltage). pkg base gnd the center metal base of the qfn package provides dc and rf ground as well as heat sink for the amplifier. input match vcc interstage match rf out bias
4 of 11 RF5102 ds110617 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com. package drawing pin out shaded lead is pin 1. dimensions in mm. 0.90 0.85 0.05 c 0.05 0.00 0.70 0.65 12 max -c- seating plane 0.60 0.24 typ 0.50 0.30 pin 1 id r.20 0.10 c ab m 0.30 0.18 0.50 1.65 1.35 sq. 1.50 typ 0.10 c a 2 plcs -a- 3.00 0.10 c b 2 plcs 1.37 typ 0.10 c a 2 plcs 2.75 sq 0.10 c b 2 plcs 3.00 -b- rf in rf in nc nc nc nc vreg1 vreg2 pdetect rf out vcc b vcc1 nc rf out vcc2 16 15 14 13 5 6 7 8 9 10 11 12 4 3 2 1 nc
5 of 11 RF5102 ds110617 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com. evaluation board schematic - 3.3v 50 ??? strip j1 rf in c2 1 nf c3 1 nf c9 330 pf r2 68 ? vreg1 and 2 pdetect c10 2. 2 pf l2 6. 8 nh coilcraft l1 7. 5 nh c6 1 ? f c7 1 ? f c1 1 nf vcc gnd p2-1 pdetect p2-3 vreg2 p2-4 vreg1 p2 1 2 3 4 hdr_1x4 p4 1 gnd 50 ??? strip j2 rf out c12 10 pf 16 15 14 13 5 6 7 8 9 10 11 12 4 3 2 1 1 1 1 1 p3 1 p3-1 vcc p1 1 2 c8 4. 7 ? f c11 dnp tl tl tl = 112 mils ( 50 ? ) from ic ( measured to center of c 10 pad) gnd vcc p1-1 5125400, r.- r5 27 ? r4 0 ? notes: 1. pins 1, 4, 13, and 15 may be left as no connect. 2. c2 and c3 bypass caps can be removed if vreg1 and vreg 2 are cupplied with clean voltages. *dnp = do not place
6 of 11 RF5102 ds110617 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com. evaluation board schematic - 5v 50 ??? strip j1 rf in c2 1 nf c3 1 nf c9 330 pf r2 0 ? vreg1 and 2 pdetect c10 1.5 pf l2 6.8 nh coilcraft l1 7.5 nh c6 1 ? f c7 1 ? f c1 1 nf vcc gnd p2-1 pdetect p2-3 vreg2 p2-4 vreg1 p2 1 2 3 4 hdr_1x4 p4 1 gnd 50 ??? strip j2 rf out c12 10 pf 16 15 14 13 5 6 7 8 9 10 11 12 4 3 2 1 1 notes: 1. pins 1, 4, 13, and 15 may be left as no connect. *dnp=do not place 2. c2 and c3 bypass caps can be removed if vreg1 and vreg2 are supplied with clean voltages. 1 1 1 p3 1 p3-1 vcc p1 1 2 c8 4.7 ? f c13 dnp* tl tl = 200 mils (50 ? ) from ic (or 55 mils from center of c13 pad to center of c11 pad) tl tl = 90 mils (50 ? ) from ic (measured to the center of c10 pad) gnd vcc p1-1 5125400, r.- r5 56 ? tl c11 1.0 pf r6 3 ? r4 1.8 k ?
7 of 11 RF5102 ds110617 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com. evaluation board layout board size 2.0? x 2.0? board thickness 0.031?, board material fr-4, multi-layer
8 of 11 RF5102 ds110617 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com. 3.3v operation typical performance evm versus output power versus frequency v cc =3.3v, ofdm 54mbps, 50% duty cycle, temp=25c 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 0.0 3.0 6.0 9.0 12.0 15.0 18.0 21.0 24.0 27.0 output power (dbm) evm (%) 2400 mhz 2450 mhz 2500 mhz gain versus output power versus frequency v cc =3.3v, ofdm 54mbps, 50% duty cycle, temp=25c 24.0 26.0 28.0 30.0 32.0 0.0 3.0 6.0 9.0 12.0 15.0 18.0 21.0 24.0 27.0 output power (dbm) gain (db) 2400 mhz 2450 mhz 2500 mhz i cc versus output power versus frequency v cc =3.3v, ofdm 54mbps, 50% duty cycle, temp=25c 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.00 3.00 6.00 9.00 12.00 15.00 18.00 21.00 24.00 27.00 output power (dbm) i cc (a) 2400 mhz 2450 mhz 2500 mhz p detect versus output power versus frequency v cc =3.3v, ofdm 54mbps, 50% duty cycle, temp=25c 0.0 0.5 1.0 1.5 2.0 0.0 3.0 6.0 9.0 12.0 15.0 18.0 21.0 24.0 27.0 output power (dbm) p detect (v) 2400 mhz 2450 mhz 2500 mhz
9 of 11 RF5102 ds110617 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com. pcb design requirements pcb surface finish the pcb surface finish used for rfmd's qualification process is electroless nickel, immersion gold. typical thickness is 3 ? inch to 8 ? inch gold over 180 ? inch nickel. pcb land pattern recommendation pcb land patterns for rfmd components are based on ipc-735 1 standards and rfmd empirica l data. the pad pattern shown has been developed and tested for optimized assembly at rf md. the pcb land pattern has been developed to accommodate lead and package tolerances. since surface mount processes vary from company to company, careful process development is recommended. pcb metal land pattern a = 0.64 x 0.28 (mm) typ. b = 0.28 x 0.64 (mm) typ. c = 1.50 (mm) sq. b b b b a a a a b b b b a a a a c pin 16 pin 1 pin 12 pin 8 dimensions in mm. 0.50 typ. 1.50 typ. 0.50 typ. 0.55 typ. 0.55 typ. 0.75 typ. 0.75 typ. 1.50 typ. figure 1. pcb metal land pattern (top view)
10 of 11 RF5102 ds110617 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com. pcb solder mask pattern liquid photo-imageable (lpi) so lder mask is recommended. the solder mask footprint will match what is shown for the pcb metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. the center-grounding pad shall also have a solder mask clearance. expansion of the pads to create solder mask clearance can be provided in the master data or reques ted from the pcb fabrication supplier. thermal pad and via design the pcb land pattern has been designed with a thermal pad th at matches the die paddle size on the bottom of the device. thermal vias are required in the pcb layout to effectively conduct heat away from the package. the via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. the via pattern used for the rfmd qualification is based on th ru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm pl ating on via walls. if micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. a = 0.74 x 0.38 (mm) typ. b = 0.38 x 0.74 (mm) typ. c = 1.60 (mm) sq. dimensions in mm. 1.50 typ. 0.50 typ. 0.50 typ. 0.55 typ. 0.55 typ. 0.75 typ. 0.75 typ. 1.50 typ. pin 16 pin 1 pin 12 pin 8 b b b b a a a a b b b b a a a a c figure 2. pcb solder mask pattern (top view)
11 of 11 RF5102 ds110617 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com. rohs compliant: yes package total weight in grams (g): 0.015 compliance date code: n/a bill of materials revision: - pb free category: e3 pb cd hg cr vi pbb pbde die 000000 molding compound 000000 lead frame 000000 die attach epoxy 000000 wire 000000 solder plating 000000 * directive 2002/95/ec of the european parliament and of the council of 27 january 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment rohs* banned material content bill of materials parts per million (ppm) this rohs banned material content declaration was prepared solely on information, including analytical data, provided to rfmd b y its suppliers, and applies to the bill of materials (bom) revision noted above.

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